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MIJING Z20MAX Middle Layer Tin Planting Platform for iPhone 18 P/PM
The MIJING Z20MAX is a professional middle-layer tin planting platform designed for iPhone 18 P and iPhone 18 Pro Max motherboard repair. It helps technicians position the board accurately during tin planting, reballing and layered motherboard restoration.
Key Features
- Purpose-built fixture for iPhone 18 P/PM series middle-layer repair.
- Stable positioning for accurate tin planting and reballing work.
- Supports controlled alignment during board-level repair and soldering.
- Compact professional tool for mobile repair benches and workshops.
- MIJING precision design for repeatable repair results.
Applications
Use the Z20MAX platform for motherboard layering, middle-layer tin planting, IC rework preparation and precision soldering on compatible iPhone 18 series boards. Secure the board correctly before applying heat and always use suitable temperature and pressure settings.
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