Description

JTX ZX-01 24 in 1 Middle Layer Reballing Platform for iPhone X to 15Pro Max

JTX JITONGXUE ZX-01 24 In1 Middle Layer Positioning Silicone Tin Planting Platform for IPX-15 Series CPU Chips BGA Reballing Stencil Kit

Features:

• Middle layer tin planting platform set for iPhone X/XS/XS Max/11/ 11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15 Plus/15 Pro/15Pro Max

• Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit

• Precise positioning / Fast tin planting / Strong magnetic adsorption

• Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism

• High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls

• Anti-drum, so that each solder ball is round and full, to meet the needs of various chips

• With precise positioning, it is more convenient to align the whole position

• Silicone material is used to effectively isolate temperature and prevent scalding

• The real machine is measured to ensure accuracy, and each detail, hole position, and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing

Package includes:

• 1 x Base

• 5 x Module Fixture

• 17 x Steel Net
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