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JTX T4 Max Universal Chip Repair Platform
The JTX T4 Max is a universal chips glue removal and tin planting platform designed for precise smartphone motherboard and PCB repair. Its stable fixture helps technicians hold chips securely while removing adhesive residue, preparing pads and applying solder/tin evenly for reliable reballing work.
Key Features
- Universal support for multiple chip sizes and motherboard layouts.
- Stable clamping platform for glue removal, tin planting and IC preparation.
- Durable repair-grade construction for professional service centers.
- Improves alignment, control and repeatability during reballing work.
- Suitable for mobile phone, tablet and other compact PCB repairs.
Specifications
| Brand | JTX |
|---|---|
| Model | T4 Max |
| Product type | Universal chip repair platform set |
| Main function | Chip glue removal and tin planting |
| Compatibility | Universal / multiple chip sizes |
| Approx. weight | 0.45 kg |
Applications
Use the JTX T4 Max for motherboard layering, IC reballing preparation, chip glue cleaning, solder-ball placement and precision mobile repair workflows. It is a practical addition to a professional mobile repair tools bench.
How to Use
- Place the chip or board in the correct support position.
- Secure it firmly without over-tightening.
- Remove adhesive and prepare the surface with suitable repair tools.
- Apply tin or solder balls evenly, then inspect alignment before rework.
Always use proper ESD protection, ventilation and temperature-safe procedures. This product is intended for trained technicians.
Package Includes
1 × JTX T4 Max universal chips glue removal and tin planting platform set.
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| Weight | 0.450 kg |
|---|
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