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Forward FW-ZC01 CPU Dual-Sided Reballing Platform is a professional 93-piece, 9-series reballing stencil kit for accurate CPU, IC and BGA motherboard repair. The dual-sided positioning platform keeps chips and stencils aligned during solder-ball placement, making complex mobile board rework faster and more repeatable.
Forward FW-ZC01 Key Features
- 93 precision stencils covering 9-series CPU, IC and BGA reballing patterns.
- Dual-sided fixture for stable positioning and accurate stencil alignment.
- Designed for solder-ball placement, tin planting and CPU rework.
- Suitable for iPhone and Android motherboard repair workflows.
- Durable platform for repeated professional workshop use.
Applications
Use the FW-ZC01 for CPU reballing, eMMC/UFS rework, BGA IC reballing, NAND and Wi‑Fi IC repair, SMD micro-component work, chip rework and solder-ball replacement on mobile phone motherboards.
Specifications
| Brand | Forward |
|---|---|
| Model | FW-ZC01 |
| Type | CPU dual-sided reballing platform |
| Stencil count | 93 pieces |
| Coverage | 9-series CPU / IC / BGA patterns |
| Use | Mobile motherboard reballing and repair |
Package Contents
- 1 × Forward FW-ZC01 dual-sided reballing platform
- 93 × precision reballing stencils
- Alignment and handling accessories supplied by the manufacturer
How to Use
Clean the chip and stencil, select the correct pattern, secure the IC in the platform, align both sides, apply solder balls or paste, and complete heating/reflow according to your workstation procedure. Always use suitable ESD protection and temperature control.
Why Buy from GSMKart?
GSMKart supplies professional mobile repair tools with secure packing and technician-focused support. Browse our mobile repair tools and Forward tools.
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