More items from this sellerView All

AMAOE PD-C Planting Tin Pad Magnetic CPU BGA Reballing Platform

Brand: Amaoe Categories: , , , SKU: GSMKART-APDC

$27.88 $36.50

0 reviews

AMAOE PD-C Planting Tin Pad for iPhone A8-A17 CPU RAM BGA Reballing Platform, iPhone 6-15 Pro MAX CPU IC BGA chips reballing soldering repair, Mobile Phone BGA chip Adsorption Silicon Mat.

AMAOE PD-C Planting Tin Pad Magnetic CPU BGA Reballing Platform

Amao PD-C Universal BGA Chip Reballing Positioning Pad Tin Planting Replaceable Magnetic Base
Amaoe PD-C Tin Planting Pad high-temperature resistant insulating silicone pad. Amaoe PD-C pad used with a magnetic positioning base and is suitable for tin implantation and welding of chips with a thickness of less than 0.9mm.

Option:
1. Amaoe PD-C Tin Planting Pad only.
2. Amaoe PD-C pad with magnet base set

0.0 Average Rating Rated (0 Reviews)

Rated
0%
Rated
0%
Rated
0%
Rated
0%
Rated
0%

Be the first to review “AMAOE PD-C Planting Tin Pad Magnetic CPU BGA Reballing Platform”

Your email address will not be published. Required fields are marked *

You have to login to add images.