Description

YCS-H03 Universal Mobile Phone PCB Board Circular Fixture Motherboard Soldering CPU IC Chip Glue/Tin Removal Repair Clamp

YCS-H03 Universal High temperature resistance Universal chip soldering CPU glue removal fixture adjustable PCB motherboard repair holder

YCS-H03 universal motherboard fixture for mobile phone PCB CPU Nand chip soldering repair and glue removal.

YCS-H03 PCB Holder Fixture Features:
1. Fully applicable to various types of chips and motherboards.
2. Tin cleaning and glue removal, no need to adjust the direction, travel coaxial movement.
3. For iPhone and Android Phone full series IC chip, removal of glue and tin paste. Not blocking the knife.
4. Mobile Phone Motherboard cleaning doesn’t require adjusting the orientation, clean up at once.
5. 360 degree rotation, multi-workplaces working.