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YCS H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair
₹1,593.00 ₹1,999.00
YCS H03 MAX
Travel coaxial movement,
No need to adjust direction,
Removal of tin and glue
Suitable for various sizes of motherboard
Travel coaxial movement,
No need to adjust direction,
Removal of tin and glue
Suitable for various sizes of motherboard
Product size: 114 x 22 x 100 mm
Description
YCS H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair
YCS H03 MAX PCB Circular Fixture For Mobile Phone Motherboard Soldering BGA CPU IC Chip Mini Glue Tin Removal Repair Clamp Tools
Features:
- Larger size, more clamping space, fully applicable to various types of chips/motherboards
- Removal of tin and glue, no need to adjust the direction, travel coaxial movement
- For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
- Motherboard cleaning doesn’t require adjusting the orientation, clean up at once
- The module is suitable for various sizes of motherboards in all aspects
Package includes:
- 1 x Fixture
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