Description

XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone / Qualcomm / MTK / Hisilicon

XZZ L23-CPU Universal CPU Reballing Stencil Platform For iPhone A8~A16 /Android Series IC Chipping Planting Tin Template Fixture

Features:
Adopt new magnetic power positioning, strong magnetic force clamping firm, automatic alignment
Built-in powerful magnets, strong adsorption, no snaps, easy to pick up, fast maintenance work
Easy to operate stable clamping, put in the chip, automatic clamping, flexible pull full
The base is made of synthetic stone, green and environmentally friendly, with high-temperature resistance, high strength, dirt resistance, easy to clean characteristics
Tin-planting table using environmentally friendly rubber feet, with wear-resistant anti-skid, shock absorption, anti-pressure, anti-aging, non-toxic, tasteless, and high-temperature resistance, etc

Support model:
Qualcomm: 765G, 778G, 845, 855, 865/870, 888/888 Plus, 8 Gen1, 8+ Gen1, 8 Gen2
MTK: 720, 800, 810, 900, 1000, 1100, 9000, 9200
Hisilicon: 710, 960, 970, 810, 980, 820/985, 990, 9000
iPhone: A8, A9, A10, A11, A12, A13, A14, A15, A16

Package includes:
1 x Tin Planting Platform