Description

XZZ iPhone X-11/15 Plus Pro Max Middle Layer BGA Reballing Stencil Platform Set

XZZ iPhone X-11/15 Plus Pro Max Motherboard Middle Frame BGA Reballing Stencil Tin Template Kits With Welding Steel Mesh

Features:
Support the new iPhone 15 series middle frame rebelling platfrom, support iPhone X-15 series tin plating
Support iPhone X/11/12/13/14/15 series cell phone motherboard tinning and subsequent continuous upgrade, and the base universal after the module to avoid repeated purchases
Magnetic stability, built in three large magnets, which can tightly connect the steel mesh with the tin planting table
Shaking the product in your hand, the magnetism still persists, vigorously shaking without falling off, preventing poor tin plating effect caused by steel mesh movement
High-precision equipment processing and manufacturing, with errors close to zero, improve maintenance efficiency, and avoids repeated operations due to insufficient solder paste
Take the steel mesh from the corners to avoid large areas of mesh detachment at the same time, which may cause the solder paste to be taken away
Synthetic stone raw materials, green environmental protection tense, high temperature
resistance, high strength, dirt resistance, easy-to-clean
Crafted with precision,wear-resistant, and high toughness, selected high-quality steel to create steel mesh, with good rebound performance and long-lasting durability

Step-by-step demonstration:
Put the tinning table into the magnetic base, and fix the motherboard that needs to be tinned in the corresponding slot of the tinning table
Please take out the corresponding tinning stencil and place it in the tinning table to align with the lamination
Use the tin scraper to apply the solder paste evenly in the mesh of the tinning net
Remove the stencil, and then use a hot air gun to heat and blow until the solder paste melts

Package includes:
According to your choice