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MIJING Z22 MAX CPU BGA Reballing Stencil Platform
₹4,861.00 ₹5,499.00
The MIJING Z22 MAX CPU Chip Tin Planting BGA Reballing Stencil Platform is a professional motherboard repair tool designed for CPU tin planting and BGA reballing applications. Designed for compatible iPhone 11-17 Pro Max series and Android devices, it provides a dedicated platform for precision CPU and motherboard repair work.
Available at GsmKart.me. Contact us to confirm the latest price, exact compatibility, and package contents before ordering.
MIJING Z22 MAX CPU Chip Tin Planting BGA Reballing Stencil Platform for iPhone 11-17PM / Android
Product Description
The MIJING Z22 MAX CPU Chip Tin Planting BGA Reballing Stencil Platform is a professional repair platform designed for technicians performing CPU chip tin planting, BGA reballing, and precision motherboard repair.
Designed for mobile phone motherboard repair, the Z22 MAX is suitable for professional technicians working on compatible iPhone 11 to iPhone 17 Pro Max series and Android devices. The platform is intended to help technicians position and handle compatible CPU chips and BGA reballing stencils during precision repair procedures.
Its dedicated platform design can help create a more stable and organized working setup when performing delicate CPU reballing and tin planting operations.
Key Features
- Professional BGA Reballing Platform: Designed for CPU chip tin planting and BGA reballing applications.
- Wide Device Application: Designed for compatible iPhone 11–17 Pro Max series and Android motherboard repair.
- Precision Positioning: Helps provide a stable platform during chip and stencil positioning.
- CPU Reballing Work: Suitable for professional CPU chip reballing and tin planting workflows.
- Mobile Motherboard Repair: Designed for advanced smartphone motherboard repair technicians.
- Professional MIJING Tool: Suitable for mobile phone repair workshops and motherboard repair professionals.
Applications
The MIJING Z22 MAX CPU Chip Tin Planting BGA Reballing Stencil Platform is suitable for:
- CPU chip reballing
- BGA reballing
- CPU tin planting
- Smartphone motherboard repair
- iPhone motherboard repair
- Android motherboard repair
- IC and CPU repair workflows
- Professional micro-soldering and board-level repair
Designed for Precision CPU Reballing
CPU and BGA reballing require accurate positioning and careful handling of chips and stencils. The MIJING Z22 MAX is designed to provide a dedicated platform for these precision repair procedures.
It can be used as part of a professional motherboard repair workstation together with suitable stencils, soldering equipment, heating equipment, and other BGA reballing tools.
Compatible Applications
The Z22 MAX is designed for use with compatible:
- iPhone 11 Series
- iPhone 12 Series
- iPhone 13 Series
- iPhone 14 Series
- iPhone 15 Series
- iPhone 16 Series
- iPhone 17 Series / 17 Pro Max
- Android Devices
Compatibility may vary by exact CPU, chip generation, motherboard version, and stencil configuration. Please confirm compatibility before ordering.
Why Choose MIJING Z22 MAX?
The MIJING Z22 MAX is designed for professional technicians handling advanced motherboard-level repair tasks.
Its dedicated reballing platform can help create a more controlled and organized setup for CPU chip tin planting and BGA reballing. This makes it a useful tool for technicians involved in high-level smartphone motherboard repair and refurbishment.
Product Specifications
| Specification | Details |
|---|---|
| Brand | MIJING |
| Model | Z22 MAX |
| Product Type | CPU Chip Tin Planting & BGA Reballing Platform |
| Main Application | CPU Reballing / BGA Reballing |
| Compatible Applications | iPhone 11–17 Pro Max / Android |
| Repair Level | Motherboard / Board-Level Repair |
| Suitable For | Professional Mobile Repair Technicians |
Please confirm the exact supported CPU models, stencil compatibility, supported motherboard versions, dimensions, and package contents with GsmKart before ordering.
Buy MIJING Z22 MAX from GsmKart.me
Get the MIJING Z22 MAX CPU Chip Tin Planting BGA Reballing Stencil Platform from GsmKart.me for professional mobile phone motherboard repair and CPU reballing work.
GsmKart offers professional BGA reballing tools, CPU stencils, IC repair tools, motherboard repair equipment, micro-soldering tools, and mobile repairing professional tools.
🌐 Website: GsmKart.me
📲 Contact GsmKart on WhatsApp to confirm the latest price, compatibility, and stock availability before placing your order.
GsmKart™ | EST 2019
📲 Mobile Repairing Professional Tools