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Mijing Z21 Max CPU Reballing Stencil Platform with BGA Reballing Stencil for iPhone A8/A9/A10/A11/A12/A13/A14/A15/A16/A17

2,099.00

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Description

Mijing Z21 Max CPU Reballing Stencil Platform with BGA Reballing Stencil for iPhone A8/A9/A10/A11/A12/A13/A14/A15/A16/A17

MiJing Z21 Max CPU IC Chip Reballing Stencil Station for iPhone

Z21 Max CPU Reballing Stencil Platform
Z21 Max CPU Reballing Stencil Platform
iPhone CPU Reballing Stencil
iPhone CPU Reballing Stencil
Mijing Z21 Max CPU Reballing Stencil Platform
Mijing Z21 Max CPU Reballing Stencil Platform

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Features:

  • Automatic precise positioning
  • The new magnetic dynamic original positioning
  • Strong magnetic force automatic clamping

Installation Method:

  • Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
  • Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)

Package includes:

  • 1 x Tin planting platform set(choose iPhone set)

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