Magic Pad Multi-functional Positioning Presssure-reducing Protective for BGA CPU IC Reballing Orignal Pad

Description

Magic Pad Multi-functional Positioning Presssure-reducing Protective Orignal Pad for BGA CPU IC Reballing

Magic Pad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing

WHAT IS IT FOR? – This Magic Pad is specifically designed for the reballing BGA CPU IC, replacing the front camera and infrared camera cable, also used for repairing iPhone face ID dot matrix cables.

CPU PROTECTION – When using this mat to repair a CPU the design offers more protection to the CPU when you do things such as planting tin.

SAFE CAMERA REPAIR – It is much safer to use this mat when repairing the front camera or the infrared camera cable, as this mat helps to avoid camera blurring caused by the heat.

HEAT RESISTANT – Keeps it shape when under extreme heat, making it perfect for reballing work.

PARTS SECTIONS – Perfectly sized areas for resting parts and keeping your workspace organised.

Features:

Heat Resistant

Protects CPU and stops camera blur

Size: 11.8 x 9.8 x 1.5cm

Weight: 0.07kg

Used for BGA, IC, CPU, Face ID and Camera repairs

Part slots for Face ID, Home button, Camera and Dot matrix parts

Durable material to make it longer lasting

Package Contents:

1 x Magic Pad Multifunctional Reduced Pressure Protective Silicone Pad for Reballing