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Luowei LW-PT03 Multifunctional Tin Planting Platform for CPU / Hard Disk / WiFi / Mid-level Soldering
₹1,189.00 ₹1,499.00
LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair. Anti-slip, no bulging, high temperature resistant. Luowei multi-function BGA reballing magnetic platform has zero error positioning and expandable base, suitable for chips with thickness less than 0.9mm and double-layer components.
Description
Luowei LW-PT03 Multifunctional Tin Planting Platform for CPU / Hard Disk / WiFi / Mid-level Soldering
Features:
Multifunction tin planting platform for CPU & Mid-level & Chip & Hard disk & Soldering, zero error positioning, expandable base
six strong magnets, soft silicone, aerospace aluminum alloy, heat-resistant and easy-to-clean
Strong magnetic adsorption, ensures the steel mesh does not easily fall off or shift, suitable for chips with a thickness of less than 0.9mm
Equipped with six powerful magnets to ensure the soldering steel mesh adheres closely, fearless of any wobbling
highly flexible and non-deforming, good elasticity, can be freely curled, maintains shape, and performance over long-term use
Heat-resistant and non-slip, can withstand high temperatures up to 500℃, has adhesive properties, providing anti-slip effects
High-strength magnetic steel screen, strong magnetic adsorption design, ensuring more secure and stable soldering, won’t fall off even when shaken vigorously
Good compatibility, compatible with chips thinner than 0.9mm most current smartphone chips assist with soldering
Universal expansion base, adaptable to the middle layer positioning plate, one-time purchase, long-term applicability, supporting future development of middle layer positioning plates
Package includes:
1 x Tin Planting Base
1 x Silicone Mat
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