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AMAOE A8-A19 Pro CPU Reballing Platform With Stencil for iPhone 8-17

₹8,999.00 ₹9,499.00

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AMAOE A8-A19 Pro CPU reballing platform with precision stencil and magnetic positioning base for iPhone 8–17 motherboard repair, CPU reballing and tin planting.

10 in stock

AMAOE A8-A19 Pro CPU Reballing Platform for iPhone 8–17

The AMAOE A8-A19 Pro CPU reballing platform is a professional precision fixture for iPhone motherboard repair, CPU reballing, RAM reballing and BGA tin planting. Its magnetic positioning base keeps the chip and stencil aligned while you apply solder balls, flux and controlled heat.

AMAOE A8-A19 Pro CPU reballing platform with stencil for iPhone 8 to 17

AMAOE A8-A19 Pro Features

  • Magnetic positioning base for stable chip alignment
  • Precision stencil support for CPU, RAM and motherboard BGA reballing
  • Designed for iPhone 8, X, 11, 12, 13, 14, 15, 16 and 17 repair workflows
  • Supports A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18 and A19 series chips
  • Useful for tin planting, solder-ball placement and IC refurbishment
  • Suitable for mobile repair technicians, refurbishers and electronics service centres

Compatible iPhone CPU Series

The AMAOE A8-A19 Pro platform is made for a wide range of iPhone CPU and RAM repair jobs. Select the matching stencil for the chip generation being repaired. The A12, A13, A14, A15, A16, A17, A18, A18 Pro, A19 and A19 Pro series options help technicians maintain consistent positioning across newer iPhone boards.

For older boards, the same style of magnetic fixture can be used with the correct stencil and solder-ball size. Always confirm the stencil marking before beginning a repair to avoid incorrect alignment.

How to Use the Reballing Platform

  1. Clean the CPU or RAM chip and prepare the motherboard surface.
  2. Place the chip in the magnetic positioning base and confirm the orientation.
  3. Fit the matching AMAOE stencil over the chip and check that the apertures are centred.
  4. Apply suitable flux and solder balls, then remove excess balls before heating.
  5. Use your normal rework process and inspect the finished solder array under magnification.

A stable fixture reduces stencil movement and improves repeatability. Use ESD protection, suitable temperature control and safe handling procedures throughout the repair.

Professional Mobile Repair Applications

Use this AMAOE CPU reballing platform for iPhone motherboard refurbishment, no-power repair, CPU-to-board reballing, RAM reballing, BGA chip alignment and tin planting. It is a practical addition to a professional mobile repair tools workstation and pairs well with other Amaoe tools.

Package Contents

1 × AMAOE A8-A19 Pro CPU reballing platform with compatible stencil system. The exact stencil option may vary by selected set or manufacturer batch, so please confirm the required iPhone series before purchase.

Repair note: Use suitable solder balls, flux, heating equipment, microscope magnification and ESD protection. Product images are for reference; packaging and included stencil combinations may be updated by the manufacturer.

Reference: manufacturer product page.

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